Precise empowerment, value co-creation. Taking customer needs as the core, relying on technical accumulation in fields such as semiconductor materials, PCB, and photovoltaics, provide customized electroplating solutions. Through the accumulation of service experience with 120 customers, establish a rapid demand response mechanism, achieve the upgrade from “meeting specifications” to “creating value”, allowing customers to focus on core production and leaving complex process optimization to Zhongdu.
Digital and intelligent management, foundation building from the source. Adhering to the concept of “do it right the first time, do it right every time”, transform the R&D advantages of the electrochemical team into quality prevention capabilities. Build a full-process digital and intelligent system covering raw material inspection, production process, and finished product verification. Predict the stability of the plating solution through algorithms, and realize precise control of key process parameters, reducing quality risks from the source and strictly abiding by military-grade confidentiality and compliance bottom lines.
Technological breakthroughs, closed-loop problem-solving. Adhere to the dual-drive of problem orientation and technological innovation. Aiming at the “stuck neck” problems in the electroplating industry, collaborate with industry-university-research platforms of Shanghai University and Xiamen University to establish a double-zero mechanism for quality problems (technical zeroing + management zeroing). Invest 15% of annual revenue in R&D to build quality competitiveness through technological iteration.
Based on the strength of a national high-tech enterprise, build a strong quality chain of “raw materials – R&D – production – service”. Through technological innovation of cyanide-free and low-energy consumption of environmental protection electroplating additives, help customers achieve carbon emission reduction goals, and collaborate with upstream and downstream to build a green manufacturing ecosystem. Promote the co-construction of industry standards, and rely on the “Provincial Innovation and Entrepreneurship” talent project to cultivate quality brands and achieve sustainable high-quality development.
Focusing on two key process links: electronic electroplating and precision surface treatment, we have established three major product matrices: high-end electroplating additives (semiconductor grade/photovoltaic grade/general grade), chemical plating solutions (palladium-free activator/high corrosion-resistant coating system), and supporting process solutions. Our core technological advantages are reflected in:
The performance of the independently developed tin-silver electroplating additive for semiconductor packaging is comparable to that of Atotech and Lisi Chemicals, with a cost reduction of 40%. It has been verified by domestic leading packaging and testing factories and has achieved mass production substitution
Relying on the electrochemical doctoral team (5 members) and the joint laboratory of Shanghai University, we can complete formula adjustment and process adaptation within 30 days according to the characteristics of the customer’s production line
