Deposits high-performance, dense, flat, and anti-tarnish silver plating.
It deposits a 0.2-0.7 μm silver layer within 1-3 minutes.
It has low contact resistance and long-term reliability, with excellent soldering strength and wire bonding capabilities.
It meets complex wiring design requirements and is applicable to ceramic substrates, PCB, powder coating, 3D-MID, photovoltaic, and other industries.
