Provides both fast and slow electroless silver plating systems, along with pre- and post-treatment solutions.
It deposits high-performance, dense, and flat silver plating with good soldering capabilities and long-term reliability.
It deposits a 0.2-0.7 μm silver layer on 1.5*1.5 mm pads within 1-3 minutes.
It has strong lead-free soldering strength and is easy to assemble.
It can completely replace expensive electroless silver plating solutions from foreign companies and is applicable to ceramic substrates, PCB boards, powder coating, 3D-MID, photovoltaic, and other industries.
