A water-soluble liquid that prevents discoloration and oxidation of copper surfaces after electroless copper plating and electroplating copper.
It can be used as the final surface treatment for bare copper boards, replacing hot air leveling.
It provides long-term storage protection for printed circuit boards with bare copper surfaces.
The plating layer is completely transparent, and its corrosion resistance is many times that of uncoated copper.
It contains no chromate and is very economical to use.
It can be used in the final water washing tank after copper plating, eliminating the need for board rinsing.
The protective film can be completely removed by degreasing and then pickling.
