A water-soluble series with excellent bath solution control and stability.
The bath solution has good stability, no by-products, and no precipitation even when the temperature is abnormal.
It is suitable for protecting PCB/FPCB copper surfaces or copper alloy surfaces.
After treatment, the copper surface is covered and protected by a strong organic film, maintaining the flatness of the copper surface and preventing oxidation.
It can withstand 3 reflow cycles and multiple through-hole wave soldering processes.
When used with Zhongdu Technology’s degreasing agent SC-2020, the nano coating effect is better.
All solution components can be analyzed and controlled, and it is suitable for tank-type and horizontal equipment.
Copper plating applicable
The plating solution has good stability
Imported Alternative
The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.