HS-168 High Current, Low Stress Acid Copper Process

产品简介

  • Excellent ductility (25-30%) and tensile strength (300-420 N/mm2).

  • The plating is bright, with fine grains and extremely low internal stress.

  • The current density can reach up to 50 ASD.

  • It is suitable for products with large differences in high and low potentials.

  • It is applicable to roll-to-roll, horizontal, and VCP production lines, as well as industries such as FPCB, COF, light strip boards, and PCB.

High Ductility, High Tensile Strength

Suitable For Large Potential Differences Between High And Low Voltage Levels

Wide Range of Applications

The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.

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