Produces fine-grained, tough copper plating with uniform thickness distribution.
It is suitable for aspect ratios above 24:1, with a TP value of 95%.
Its ductility and tensile strength meet the requirements of the PCB and ceramic substrate industries.
It provides good filling effects for blind vias and through-holes, solving the problem of thickness uniformity in DC electroplating and significantly reducing copper consumption.
It is applicable to AI backplanes and multi-order HDI boards for GPUs (thickness above 5 mm).
