NIHP-2302 is a high phosphorus electroless nickel process with a phosphorus content of 10-12%.
The deposition rate can be maintained at 6-12 microns per hour throughout its working life.
NIHP-2302 contains no lead or cadmium and complies with the international ELV and RoHS/WEEE directives.
The plating solution has high stability and a wide operating range, making it easy to operate and control.
It contains no EDTA or boric acid and has high tolerance for metal impurities.
It has a unique stabilizer system with a service life of up to 6 cycles and is suitable for both rack plating and barrel plating.
