The electroless tin plating thickness ranges from 1.0-1.2 μm.
It uses methanesulfonic acid and sulfuric acid-based electroless tin plating solutions.
It has been applied and optimized in dozens of production lines.
It has good tin whisker resistance and is suitable for plugging holes, high aspect ratio through-holes, and blind vias.
It is suitable for fine lines, complex layouts, and roll-to-roll, horizontal, and vertical production lines.
It is paired with deionization and anti-oxidation technologies.
