TC-200 Acid Copper Electroplating Additive

Product Introduction

  • Excellent through-hole plating ability and throw power.

  • It provides good copper plating thickness with uniform distribution at high current densities.

  • It has excellent ductility (elongation 25-30%) and high tensile strength (300-420 N/mm2).

  • It has high thermal shock resistance and TCT/IST reliability, meeting all the requirements of automotive boards.

  • It features a simple two-component additive system and can be fully analyzed using CVS.

Excellent Through-hole Plating Capability

Uniform Thickness Distribution

High Thermal Shock Resistance and Reliability

The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.

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