Excellent filling capability for both Through-Holes (TH) and Blind Vias (BVH).
High-volume production (HVM) for core materials ranging from 50-300um.
Reduces production costs and improves yield rates.
High-reliability thermal shock performance.
Thermal conductivity is 50 times higher than epoxy resin plug-hole solutions.
Ideal for Wafers, Ceramic Substrates, IC Substrates, TV, and TSV applications.
