Produces a high-performance, dense, uniform, and anti-tarnish silver deposit.
Achieves 0.2-0.7 wm silver thickness within 1-3 minutes.
Low contact resistance and high long-term reliability.
superior solderability and wire bonding performance.
Ideal for complex circuit layouts and designs.
Applicable for Ceramic Substrates, PCB, Powder Coating, 3D-MID, and Photovoltaic industries.
