AU-301 produces a uniform 24k pure gold deposit on nickel surfaces.
Wide operating window with high tolerance to contamination; nickel capacity ranges from 0.5 to 1.0g/L.
Extended bath life; maintains consistent color and brightness throughout its entireservice life.
Heat-resistant gold layer with a fine-grained structure; provides excellent bonding, wire bonding, and solderability.
Widely applied in electronic components, PCB, Wafer, and Semiconductor industries.
