Oxidation Barrier: Water-reducible liquid concentrates engineered to prevent discoloration and oxidation on electroless and electroplated copper surfaces.
Premium HAS Alternative: Serves as a high-quality final finish for bare copper PCBs, offering a reliable and cost-effective alternative to Hot Air Solder Leveling (HASL).
Long-Term Passivation: Provides exceptional long-term storage protection (shelf-life extension) for PCBs with exposed bare copper.
Optical Clarity & Protection: Forms a completely transparent protective film with corrosion resistance significantly exceeding that of untreated copper.
Eco-Friendly & Economic: Chromate-free formulation that ensures full environmental compliance while maintaining low operational costs.
Streamlined Process: Can be integrated into the final rinse stage; no subsequent rinsing is required, simplifying the production line.
Easy Removal: The protective layer can be effortlessly and completely removed through standard degreasing followed by acid pickling.
To meet diverse logistical and operational requirements, we offer three specialized formulations:
CU-56 (Methanol System): Optimized for specific solvent-based solubility and fast-
drying requirements.
CU-560 (Sulfuric Acid System): Designed for seamless integration into acid-based plating lines.
• CU-56HF (High Flash Point): Safety-enhanced version with a flash point exceeding 38°C 10, ideal for strict fire safety environments and serineronapp
