Water-soluble liquid designed to prevent tarnish and oxidation on copper surfaces after electroless or electroplating processes.
Can be used as a final surface finish for bare copper boards, serving as an effective alternative to Hot Air Solder Leveling (HASL).
Provides long-term storage protection for PCBs with bare copper surfaces.
The protective coating is fully transparent, offering corrosion resistance several times higher than untreated copper.
Chromate-free formulation and highly cost-effective in operation.
Can be applied in the final rinse stage after copper plating; no subsequent rinsing required.
The protective film can be completely removed through standard degreasing followed by acid pickling.
