Superior Bath Stability: A water-soluble formulation ensuring exceptional bath control and stability. No by-products or precipitation occur even during temperature fluctuations.
High-Performance Copper Protection: Engineered for the advanced protection of pure copper and copper alloy surfaces.
Ultra-Thin Robust Shield: Forms a dense and robust nano-scale organic protective film that maintains surface planarity and prevents oxidation.
Extreme Thermal Resistance: Successfully withstands up to 3 consecutive Lead-Free Reflow cycles and multiple Wave Soldering processes.
Synergistic Performance: Optimized for use in conjunction with SC-2020 Cleaner to achieve the ultimate nano-coating integrity and adhesion.
Precision Process Control: All chemical components are fully analyzable and controllable, ensuring repeatable high-yield production.
Flexible Equipment Compatibility: Suitable for both immersion (dip) tanks and high-speed horizontal conveyorized systems.
Copper plating applicable
The plating solution has good stability
Imported Alternative
The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.