Fine-grained, high-ductility copper deposit with excellent thickness uniformity.
Ideal for High Aspect Ratio (HAR) of 24:1 or greater; Throwing Power (TP) reaches 95%.
Ductility and tensile strength fully comply with industry standards for PCB and ceramic substrates.
Superior performance in both Blind Via Filling (BVH) and Through-Hole (TH) plating.
Resolves thickness uniformity issues inherent in DC plating; significantly reduces copper consumption.
Suitable for AI Backplanes and high-density multi-layer HDI boards for GPUs (thickness ≥ 5mm).
