NI-2006HSX is a Nickel Sulfamate-based plating process.
Produces semi-bright nickel deposits with low internal stress and excellent
ductility.
Particularly suitable as an underlayer for precious and non-precious metal plating.
Engineered for high-speed plating equipment using both soluble and insoluble anode systems.
Ensures exceptional crystal structure within a current density range of 5-50 ASD.
Primarily used in the manufacturing of PCBs, connectors, semiconductors, and other high-reliability electronic components.
