T600 Electroless Tin Plating

Product Introduction

  • Deposit thickness:1.0-1.2um.

  • High-performance additive for Methanesulfonic Acid (MSA) and Sulfuric Acid Systems.

  • Proven track record across dozens of production lines with extensive optimization experience.

  • Superior tin whisker suppression; ideal for via plugging, high-aspect-ratio through-holes, and blind vias.

  • Optimized for fine lines and complex layouts; compatible with Roll-to-Roll (RTR),horizontal, and vertical lines.

  • Advanced de-ionization and anti-oxidation support technology.

The Effect of Preventing Tin Whisker Is Good

Applicable To Plug Holes, Through Holes, And Blind Holes

Experience In Multiple Project Applications

The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.

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