TC-200 Acid Copper Plating Additive

Product Introduction

  •  Excellent Throwing Power (TP) for through-hole plating.

  • Superior copper thickness and uniform distribution even at high current densities(CD).

  • Excellent ductility (Elongation: 25-30%) and high tensile strength (300 – 420 N/mm²).

  • High thermal shock resistance; excellent TCT and IST reliability.

  • Fully compliant with all requirements for automotive PCBS.

  • Simple two-component additive system; fully compatible with CVS analysis.

Excellent Through-hole Plating Capability

Uniform Thickness Distribution

High Thermal Shock Resistance and Reliability

The additive fully complies with the RoHS regulations, containing no lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE.

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