Utilizes high-speed electroplating technology specifically designed for palladium-nickel （Pd-Ni） alloy plating on electronic components.
Standard deposits contain 80 wt% Palladium, but alloy content is adjustable from 50% to 90% via process control.
Stable deposit composition with less than +5% variation within a current density range of 50 to 800 ASF.
Unique formulation produces bright, ductile deposits that meet stringent contact stability requirements.
Pd-Ni alloy offers lower porosity and superior wear resistance compared to hard gold or pure palladium.
The premier choice for high-reliability connector systems.
•High plating rates and easy maintenance using standard technical procedures.
