T-70RPT
T-70RPT 化学镀锡抗变色剂 电子材料 产品简介 T-70RPT是一种水溶液酸性浓缩液，用于化学镀锡、电镀锡后的表面处理； 对高温烘烤和Reflow后易变色有很大的帮助； T-70RPT可用于水基在线喷淋清洗或浸泡清洗； 特别是回流后，T-70RPT也能显著减少锡表面变色； 用T-70RPT进行冲洗后，要彻底的纯水冲洗，以确保锡表面没有T-70RPT残留； T-70RPT处理特别适用用于多种无铅焊接要求。 镀液长期可靠 多行业通用 进口平替 添加剂完全符合RoHS条例，不含铅、镉、汞、六价铬、PBB和PBDE。 对产品感兴趣？ 立即咨询
AS-300 Slow Electroless Silver Plating
AS-300 Slow Electroless Silver Plating PCB Product Introduction Provides both fast and slow electroless silver plating systems, along with pre- and post-treatment solutions. It deposits high-performance, dense, and flat silver plating with good soldering capabilities and long-term reliability. It deposits a 0.2-0.7 μm silver layer on 1.5*1.5 mm pads within 1-3 minutes. It has strong […]
T600 Electroless Tin Plating
T600 Electroless Tin Plating PCB Product Introduction The electroless tin plating thickness ranges from 1.0-1.2 μm. It uses methanesulfonic acid and sulfuric acid-based electroless tin plating solutions. It has been applied and optimized in dozens of production lines. It has good tin whisker resistance and is suitable for plugging holes, high aspect ratio through-holes, and […]
STAN Thick Electroless Tin Plating
STAN Thick Electroless Tin Plating PCB 产品简介 STAN can deposit a thickness of 1-6 μm. It is suitable for pure copper surfaces, with a matte appearance. It meets all the requirements of modern and environmentally friendly lead-free surface treatment. It does not require electricity or anodes and can replace existing electroplating tin processes. It meets […]
HS-168 High Current, Low Stress Acid Copper Process
HS-168 High Current, Low Stress Acid Copper Process PCB 产品简介 Excellent ductility (25-30%) and tensile strength (300-420 N/mm2). The plating is bright, with fine grains and extremely low internal stress. The current density can reach up to 50 ASD. It is suitable for products with large differences in high and low potentials. It is applicable […]
5G-100 Pulse Through-Hole Filling
5G-100 Pulse Through-Hole Filling PCB 产品简介 Excellent through-hole and blind via filling capabilities. It can mass-produce core layer materials of 50-300 μm, reducing production costs and improving yield. It has high-reliability thermal shock performance and 50 times higher thermal conductivity than plugging resins. It is suitable for wafers, ceramic substrates, IC carriers, TGV, and TSV. […]
AG-600B Fast Electroless Silver Plating
AG-600B Fast Electroless Silver Plating PCB Product Introduction Deposits high-performance, dense, flat, and anti-tarnish silver plating. It deposits a 0.2-0.7 μm silver layer within 1-3 minutes. It has low contact resistance and long-term reliability, with excellent soldering strength and wire bonding capabilities. It meets complex wiring design requirements and is applicable to ceramic substrates, PCB, […]
VF-201 DC Blind Via Filling
VF-201 DC Blind Via Filling PCB Product Introduction Can fill blind vias and plate through-holes simultaneously. It deposits a bright copper structure with excellent grain quality. The plating solution has a long service life, with excellent ductility and tensile strength. It is compatible with both copper balls and insoluble anodes. High Ductility, High Tensile Strength […]
TC-200 Acid Copper Electroplating Additive
TC-200 Acid Copper Electroplating Additive PCB Product Introduction Excellent through-hole plating ability and throw power. It provides good copper plating thickness with uniform distribution at high current densities. It has excellent ductility (elongation 25-30%) and high tensile strength (300-420 N/mm2). It has high thermal shock resistance and TCT/IST reliability, meeting all the requirements of automotive […]
MC-1200 Pulse Copper Plating
MC-1200 Pulse Copper Plating PCB Product Introduction Produces fine-grained, tough copper plating with uniform thickness distribution. It is suitable for aspect ratios above 24:1, with a TP value of 95%. Its ductility and tensile strength meet the requirements of the PCB and ceramic substrate industries. It provides good filling effects for blind vias and through-holes, […]