CU-56HF Copper Anti-Tarnish Agent
CU-56HF Copper Anti-Tarnish Agent Solar Product Introduction Water-soluble liquid designed to prevent tarnish and oxidation on copper surfaces after electroless or electroplating processes. Can be used as a final surface finish for bare copper boards, serving as an effective alternative to Hot Air Solder Leveling (HASL). Provides long-term storage protection for PCBs with bare copper […]
AS-300 Immersion Silver Additive (Controlled Speed)
AS-300 Immersion Silver Additive (Controlled Speed) PCB Product Introduction Provides both fast and slow electroless silver plating systems, along with pre- and post-treatment solutions. It deposits high-performance, dense, and flat silver plating with good soldering capabilities and long-term reliability. It deposits a 0.2-0.7 μm silver layer on 1.5*1.5 mm pads within 1-3 minutes. It has […]
T600 Immersion Tin Additive
T600 Electroless Tin Plating PCB Product Introduction Deposit thickness:1.0-1.2um. High-performance additive for Methanesulfonic Acid (MSA) and Sulfuric Acid Systems. Proven track record across dozens of production lines with extensive optimization experience. Superior tin whisker suppression; ideal for via plugging, high-aspect-ratio through-holes, and blind vias. Optimized for fine lines and complex layouts; compatible with Roll-to-Roll (RTR),horizontal, […]
STAN Thick Immersion Tin Additive
STAN Thick Immersion Tin Additive PCB Product Advantages Achievable deposit thickness of 1-6 pm. Suitable for pure copper surfaces with a professional matte finish. Fully meets modern environmental standards for lead-free surface treatments. Non-electrolytic process: no external power or anodes required. Ideal replacement for conventional electro-tin plating processes. Complies with all requirements for Reflow and […]
VP-100 Roll-to-Roll (RTR) Acid Copper Plating Additive
VP-100 Roll-to-Roll (RTR) Acid Copper Plating Additive PCB Product Advantages Excellent ductility (25-30%) and high tensile strength (300-420 N/mm²). Bright deposit, fine-grained structure, and extremely low internal stress. Maximum current density up to 50 ASD. Ideal for products with high current density distribution differentials. Compatible with Roll-to-Roll (RTR), Horizontal, and VCP production lines. Widely used […]
5G-100 Pulse Plating for Through-Hole & Blind Via Filling
5G-100 Pulse Plating for Through-Hole & Blind Via Filling PCB 产品简介 Excellent filling capability for both Through-Holes (TH) and Blind Vias (BVH). High-volume production (HVM) for core materials ranging from 50-300um. Reduces production costs and improves yield rates. High-reliability thermal shock performance. Thermal conductivity is 50 times higher than epoxy resin plug-hole solutions. Ideal for […]
AG-600B Immersion Silver Additive (High-Speed)
AG-600B Immersion Silver Additive (High-Speed) PCB Product Introduction Produces a high-performance, dense, uniform, and anti-tarnish silver deposit. Achieves 0.2-0.7 wm silver thickness within 1-3 minutes. Low contact resistance and high long-term reliability. superior solderability and wire bonding performance. Ideal for complex circuit layouts and designs. Applicable for Ceramic Substrates, PCB, Powder Coating, 3D-MID, and Photovoltaic […]
VF-201 DC Blind Via Filling Additive
VF-201 DC Blind Via Filling Additive PCB Product Introduction Simultaneous blind via filling and through-hole plating. Produces a bright deposit with an excellent fine-grained copper structure. Extended bath life / Long electrolyte longevity. Excellent ductility and tensile strength. Compatible with both copper balls and insoluble anodes. High Ductility, High Tensile Strength Applicable to Through-holes and […]
TC-200 Acid Copper Plating Additive
TC-200 Acid Copper Plating Additive PCB Product Introduction Excellent Throwing Power (TP) for through-hole plating. Superior copper thickness and uniform distribution even at high current densities(CD). Excellent ductility (Elongation: 25-30%) and high tensile strength (300 – 420 N/mm²). High thermal shock resistance; excellent TCT and IST reliability. Fully compliant with all requirements for automotive PCBS. […]
MC-1200 Pulse Acid Copper Plating Additive
MC-1200 Pulse Acid Copper Plating Additive PCB Product Introduction Fine-grained, high-ductility copper deposit with excellent thickness uniformity. Ideal for High Aspect Ratio (HAR) of 24:1 or greater; Throwing Power (TP) reaches 95%. Ductility and tensile strength fully comply with industry standards for PCB and ceramic substrates. Superior performance in both Blind Via Filling (BVH) and […]