Product Catalog

ANKOR-280NF Hard Chrome Plating

High-speed, fluoride-free hard chrome plating process

CR-96 High Salt Spray Resistant Gray Chrome Plating

Low-temperature high-corrosion-resistant chrome plating process

XM-2000 High Wear-Resistant Composite Chrome Plating

Electroplating process for low-temperature composite materials

DYNE-30 Chrome Mist Inhibitor

Significantly reduce the surface tension of hexavalent chromium plating solution

CU-560, CU-56, CU-56HF Copper Surface Protectant

It can prevent discoloration and oxidation of copper surface after chemical copper plating and electroplating

ZH-558 Copper Blackening Agent

It can effectively reduce the reflectivity of the copper surface

HELIOS-232 Nano Coating

Water-soluble series, with good bath control and stability

AZN-680 Acid Zinc-Nickel Alloy

Weakly acidic zinc-nickel alloy process

AZN-222 Alkaline Zinc-Nickel Alloy

Alkaline zinc-nickel alloy electroplating process

AZN-2430 Alkaline Zinc-Nickel Alloy

Alkaline zinc-nickel alloy electroplating process

High Phosphorus Electroless Nickel NIHP-2302

High-phosphorus chemical nickel process with a phosphorus content of 10-12%

Medium Phosphorus Electroless Nickel NIMP-1614

The phosphorus content is between 7% and 9%

Low Phosphorus Electroless Nickel NILP-606

Low-phosphorus electroless nickel plating process

TC-200 Acid Copper Electroplating Additive

Excellent through-hole plating capability

MC-1200 Pulse Copper Plating

Suitable for aspect ratios above 24:1

5G-100 Pulse Through-Hole Filling

Low-temperature composite material electroplating process

HS-168 High Current, Low Stress Acid Copper Process

Significantly reduce the surface tension of hexavalent chromium plating solution

VF-201 DC Blind Via Filling

It can simultaneously fill blind holes and plate through-holes

T600 Electroless Tin Plating

The thickness of the electroless tin plating layer is 1.0-1.2um

STAN Thick Electroless Tin Plating

STAN can deposit a thickness of 1-6um

AG-600B Fast Electroless Silver Plating

High-performance, dense, flat, and anti-tarnishing silver plating

AS-300 Slow Electroless Silver Plating

Provide fast and slow chemical silver plating systems

Powder Dispersant SC-0505K

Low usage, low cost, easy to operate

Copper Powder Anti-Oxidant CU-56HF

Provide long-term storage protection

Silver-Copper Coating Additive AG-600B

The adhesion between the silver layer and copper powder is strong

Phosphorus-Free Nickel-Copper Coating NIPF-1504

Better copper welding force and thermal welding force

Pure Tin Electroplating TC-688

The distribution of electroplating is very uniform

Electroless Tin Plating T600

The pure tin layer has strong oxidation resistance

Acid Copper Electroplating TC-200

Good copper plating thickness with uniform thickness distribution

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